4 edition of International Symposium on Advanced Packaging Materials: Processes, Properties & Interfaces : Proceedings found in the catalog.
International Symposium on Advanced Packaging Materials: Processes, Properties & Interfaces : Proceedings
Published
December 1999 by IEEE .
Written in
Edition Notes
| Contributions | Christine P. W. Wong (Contributor), International Microelectronics and Packaging Society (Contributor) |
| The Physical Object | |
|---|---|
| Format | Paperback |
| ID Numbers | |
| Open Library | OL8083371M |
| ISBN 10 | 0780355083 |
| ISBN 10 | 9780780355088 |
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